{"cvss":0.0,"datePublished":"2023-12-05","dateUpdated":"2023-12-05","description":"Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.","dueDate":"2023-12-26","id":"CVE-2023-33063","kev_catalogs":["cisa"],"knownRansomwareCampaignUse":"Unknown","notes":"This vulnerability affects a common open-source component, third-party library, or a protocol used by different products. Please check with specific vendors for information on patching status. For more information, please see: https://git.codelinaro.org/clo/la/kernel/msm-5.15/-/commit/2643808ddbedfaabbb334741873fb2857f78188a, https://git.codelinaro.org/clo/la/kernel/msm-4.14/-/commit/d43222efda5a01c9804d74a541e3c1be9b7fe110;  https://nvd.nist.gov/vuln/detail/CVE-2023-33063","product":"Multiple Chipsets","requiredAction":"Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.","severity":"HIGH","source":"cisa_known_exploited","title":"Qualcomm Multiple Chipsets Use-After-Free Vulnerability","vendor":"Qualcomm"}