cve-2022-22071

HIGH CVSS 8.4 cisa_known_exploited
Description

Multiple Qualcomm chipsets contain a use-after-free vulnerability when process shell memory is freed using IOCTL munmap call and process initialization is in progress.

Timeline
Published
2023-12-05
Last Modified
2023-12-05
CVSS Details

CVSS details not available.

Affected Products

No product information available.

References

No references available.

Linked Vulnerabilities

No linked vulnerabilities found.

{
  "cvss": 8.4,
  "datePublished": "2023-12-05",
  "dateUpdated": "2023-12-05",
  "description": "Multiple Qualcomm chipsets contain a use-after-free vulnerability when process shell memory is freed using IOCTL munmap call and process initialization is in progress.",
  "dueDate": "2023-12-26",
  "id": "CVE-2022-22071",
  "kev_catalogs": [
    "cisa"
  ],
  "knownRansomwareCampaignUse": "Unknown",
  "notes": "This vulnerability affects a common open-source component, third-party library, or a protocol used by different products. Please check with specific vendors for information on patching status. For more information, please see: https://git.codelinaro.org/clo/la/kernel/msm-5.4/-/commit/586840fde350d7b8563df9889c8ce397e2c20dda;  https://nvd.nist.gov/vuln/detail/CVE-2022-22071",
  "product": "Multiple Chipsets",
  "requiredAction": "Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.",
  "severity": "HIGH",
  "source": "cisa_known_exploited",
  "title": "Qualcomm Multiple Chipsets Use-After-Free Vulnerability",
  "vendor": "Qualcomm"
}
Enrichment data
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