cve-2024-43047

HIGH CVSS 7.8 cisa_known_exploited
Description

Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services while maintaining memory maps of HLOS memory.

Timeline
Published
2024-10-08
Last Modified
2024-10-08
CVSS Details

CVSS details not available.

Affected Products

No product information available.

References

No references available.

Linked Vulnerabilities

No linked vulnerabilities found.

{
  "cvss": 7.8,
  "datePublished": "2024-10-08",
  "dateUpdated": "2024-10-08",
  "description": "Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services while maintaining memory maps of HLOS memory. ",
  "dueDate": "2024-10-29",
  "id": "CVE-2024-43047",
  "kev_catalogs": [
    "cisa"
  ],
  "knownRansomwareCampaignUse": "Unknown",
  "notes": "https://git.codelinaro.org/clo/la/platform/vendor/qcom/opensource/dsp-kernel/-/commit/0e27b6c7d2bd8d0453e4465ac2ca49a8f8c440e2 ; https://nvd.nist.gov/vuln/detail/CVE-2024-43047",
  "product": "Multiple Chipsets ",
  "requiredAction": "Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.",
  "severity": "HIGH",
  "source": "cisa_known_exploited",
  "title": "Qualcomm Multiple Chipsets Use-After-Free Vulnerability",
  "vendor": "Qualcomm"
}
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