cve-2026-21385
HIGH cisa_known_exploited
Description
Multiple Qualcomm chipsets contain a memory corruption vulnerability while using alignments for memory allocation.
Timeline
- Published
- 2026-03-03
- Last Modified
- 2026-03-03
CVSS Details
CVSS details not available.
Affected Products
No product information available.
References
No references available.
Linked Vulnerabilities
No linked vulnerabilities found.
{
"cvss": 0.0,
"datePublished": "2026-03-03",
"dateUpdated": "2026-03-03",
"description": "Multiple Qualcomm chipsets contain a memory corruption vulnerability while using alignments for memory allocation. ",
"dueDate": "2026-03-24",
"id": "CVE-2026-21385",
"kev_catalogs": [
"cisa"
],
"knownRansomwareCampaignUse": "Unknown",
"notes": "Please check with specific vendors (OEMs,) for information on patching status. For more information, please see: https://source.android.com/docs/security/bulletin/2026/2026-03-01 ; https://nvd.nist.gov/vuln/detail/CVE-2026-21385",
"product": "Multiple Chipsets",
"requiredAction": "Apply mitigations per vendor instructions, follow applicable BOD 22-01 guidance for cloud services, or discontinue use of the product if mitigations are unavailable.",
"severity": "HIGH",
"source": "cisa_known_exploited",
"title": "Qualcomm Multiple Chipsets Memory Corruption Vulnerability",
"vendor": "Qualcomm"
}
Enrichment data
Aggregated bundle (all enrichments)