cve-2023-33063

{
  "cvss": 0.0,
  "datePublished": "2023-12-05",
  "dateUpdated": "2023-12-05",
  "description": "Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.",
  "dueDate": "2023-12-26",
  "id": "CVE-2023-33063",
  "kev_catalogs": [
    "cisa"
  ],
  "knownRansomwareCampaignUse": "Unknown",
  "notes": "This vulnerability affects a common open-source component, third-party library, or a protocol used by different products. Please check with specific vendors for information on patching status. For more information, please see: https://git.codelinaro.org/clo/la/kernel/msm-5.15/-/commit/2643808ddbedfaabbb334741873fb2857f78188a, https://git.codelinaro.org/clo/la/kernel/msm-4.14/-/commit/d43222efda5a01c9804d74a541e3c1be9b7fe110;  https://nvd.nist.gov/vuln/detail/CVE-2023-33063",
  "product": "Multiple Chipsets",
  "requiredAction": "Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.",
  "severity": "HIGH",
  "source": "cisa_known_exploited",
  "title": "Qualcomm Multiple Chipsets Use-After-Free Vulnerability",
  "vendor": "Qualcomm"
}